Information
                    
                    Application:
                    
                    Immersion silver, as a lead-free PCB finished surface treatment process, serves for depositing a layer of silver with thickness of 6~16μ inch on copper surface through replacement reaction to ensure flat surface; it has good conductivity and solderability.
                    
                    Advantage introduction:
                    
	Smooth surface, suitable for package of SMD and BGA;
 
	Standard surface for Au-wire & Al-wire bond, can replace electroplating nickel/gold or ENIG;
 
	Can replace electroplating nickel or silver for bonding, good reflexes as surface;
 
	Good electroconductivity for contact conduction application;
 
	Low risk of electromigration and low galvanic effect.